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STPS10170C
High voltage power Schottky rectifier
Main product characteristics
IF(AV) VRRM Tj VF (typ) 2x5A 170 V 175 C 0.69 V
A1 K A2
Features and benefits

A2 A1 K
TO-220AB STPS10170CT
2
A2 A1 K
I PAK STPS10170CR
High junction temperature capability Good trade-off between leakage current and forward voltage drop Low leakage current Avalanche capability specified
K A2 A1 DPAK STPS10170CB
K A2 A1
D2PAK STPS10170CG
Description
Dual centre tab Schottky rectifier designed for high frequency switch mode power supplies.
Order codes
Part Number STPS10170CT STPS10170CG STPS10170CG-TR STPS10170CR STPS10170CB STPS10170CB-TR Marking STPS10170CT STPS10170CG STPS10170CG STPS10170CR PS10170CB PS10170CB
July 2006
Rev 1
www.st.com
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Characteristics
STPS10170C
1
Table 1.
Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj dV/dt
1.
Characteristics
Absolute ratings (limiting values per diode, Tamb = 25 C unless otherwise specified)
Parameter Repetitive peak reverse voltage RMS forward current Average forward current, = 0.5 Surge non repetitive forward current Relative peak avalanche power Storage temperature range Maximum operating junction temperature(1) Critical rate of rise of reverse voltage
thermal runaway condition for a diode on its own heatsink
Value 170 10 Per diode 5
Unit V A A
Tc = 155 C tp = 10 ms Sinusoidal Tj = 25 C
Total package
10
75
tp = 1s
A W C C V/s
3100 -65 to + 175 175 10 000
dP tot 1 -------------- < ------------------------dT j R th ( j - a )
Table 2.
Symbol Rth(j-c) Rth(c)
Thermal parameters
Parameter Per diode Junction to case Total Coupling 2.4 0.7 C/W Value 4 Unit
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 10 10 0.92 IF = 5 A 0.69 0.75 V 1 IF = 10 A 0.79 0.85 Unit A mA
VF(2)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.02 x IF2(RMS)
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STPS10170C
Characteristics
Figure 1.
Conduction losses versus average Figure 2. forward current (per diode)
Average forward current versus ambient temperature ( = 0.5, per diode)
PF(AV)(W)
5
=0.1 =0.2 =0.5
IF(AV)(A)
6.0 5.5 5.0 4.5
=1
Rth(j-a)=Rth(j-c)
4
=0.05
4.0 3.5 3.0
Rth(j-a)=15C/W
3
2
T
2.5 2.0 1.5 1.0
T
1 IF(AV)(A) 0 1 2 3 4
=tp/T
5
tp
0.5 0.0 0
=tp/T
25
tp
Tamb (C) 50 75 100 125 150 175
0
6
Figure 3.
Normalized avalanche power derating versus pulse duration
Figure 4.
Normalized avalanche power derating versus junction temperature
PARM(tp) PARM(1s)
1
1.2 1
PARM(tp) PARM(25C)
0.1
0.8 0.6 0.4 0.2
0.01
0.001 0.01 0.1 1
tp(s)
10 100 1000
Tj(C)
0 25 50 75 100 125 150
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values, per diode)
Figure 6.
Relative variation of thermal impedance, junction to case versus pulse duration
80 70 60 50
IM(A)
Zth(j-c)/Rth(j-c)
1.0
Single pulse TO-220AB DPAK IPAK DPAK
TC=50C
40 30 20
IM
TC=75C
TC=125C
10 0 1.E-03
t
=0.5
t(s)
tp(s) 0.1
1.E-01 1.E+00
1.E-02
1.E-03
1.E-02
1.E-01
1.E+00
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Characteristics
STPS10170C
Figure 7.
Reverse leakage current versus reverse voltage applied (typical values, per diode)
Figure 8.
Junction capacitance versus reverse voltage applied (typical values, per diode)
F=1MHz VOSC=30mVRMS Tj=25C
1.E+05 1.E+04 1.E+03 1.E+02
IR(A)
C(pF)
1000
Tj=175C Tj=150C
Tj=125C
100
1.E+01 1.E+00 1.E-01
Tj=25C Tj=75C
1.E-02 0 25 50 75
VR(V) 100 125 150 175
VR(V) 10 1 10 100 1000
Figure 9.
Forward voltage drop versus forward current (per diode)
Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 m - DPAK)
Rth( -a) (C/W)
100
DPAK
100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0
IFM(A)
90 80 70
Tj=125C (Maximum values)
60 50
Tj=125C (Typical values)
j
40 30
Tj=25C (Maximum values)
20
VFM(V)
10
2.0
SCU(cm) 0 5 10 15 20 25 30 35 40
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 m - D2PAK)
80 70 60 50 40 30 20 10 SCU(cm) 0 0 5 10 15 20 25 30 35 40
Rth(j-a) (C/W)
DPAK
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STPS10170C
Package dimensions
2
Package dimensions
Epoxy meets UL94, V0 Table 4. T0-220AB dimensions
Dimensions Ref. Millimeters Min.
H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A
Inches Min. Max.
Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70
A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam.
4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10
0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106
10.40 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116
16.4 typ. 13 2.65 14 2.95
15.25 15.75 0.600 0.620 6.20 3.50 6.60 3.93 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151
2.6 typ. 3.75 3.85
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Package dimensions Table 5. I2PAK dimensions
STPS10170C
Dimensions Ref.
A E L2 c2
Millimeters Min. Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40
Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055
A A1 b b1
4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27
D
c c2
L1 L b1
A1
D e e1 E
b e e1
c
L L1 L2
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STPS10170C Table 6. DPAK dimensions
Package dimensions
Dimensions Ref. Millimeters Min.
E B2 L2 C2 A
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
A A1 A2 B
D
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
B2 C C2
H L4 B G A1
R
R C
D E G
A2 0.60 MIN.
H L2
V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
L4 V2
Figure 12. DPAK footprint (dimensions in mm)
6.7
3
3
1.6
2.3 6.7 2.3
1.6
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Package dimensions Table 7. D2PAK dimensions
STPS10170C
Dimensions Ref.
A E L2 C2
Millimeters Min. Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20
Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126
A A1 A2
D
4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40
B B2
L3 A1 B2 B G R
C C2
C
D E G
A2
L L2
M
*
V2
L3 M
* FLAT ZONE NO LESS THAN 2mm
R V2
0.40 typ. 0 8
0.016 typ. 0 8
Figure 13. D2PAK footprint (dimensions in mm)
16.90
10.30 1.30
5.08
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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STPS10170C
Ordering information
3
Ordering information
Part number STPS10170CT STPS10170CG STPS10170CG-TR STPS10170CB STPS10170CB-TR STPS10170CR Marking STPS10170CT STPS10170CG STPS10170CG PS10170CB PS10170CB STPS10170CR Package TO-220AB D PAK D2PAK DPAK DPAK I PAK
2 2
Weight 2.23 g 1.48 g 1.48 g 0.3 g 0.3 g 1.49 g
Base qty 50 50 1000 75 2500 50
Delivery mode Tube Tube Tape and reel Tube Tape and reel Tube
4
Revision history
Date 13-Jul-2006 Revision 1 First issue. Description of changes
9/10
STPS10170C
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